33662 pdf, 33662 Description, 33662 Datasheet, 33662 view ::: ALLDATASHEET :::

Part #	33662

Description	ISO 17987/LIN 2.x/SAEJ2602-2 LIN Physical Layer

File Size	774.19 Kbytes

Html View	1 2 3 4 5 6 7 8 9 Next

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

Logo

Similar Part No. - 33662

Manufacturer	Part #	Datasheet	Description
Aavid, Thermal Division...	336624B00032G	8Mb / 116P	Channel style heat sink with folded back fins
Aavid, Thermal Division...	336624B00032G	8Mb / 116P	How to Use This Catalog

Manufacturer	Part #	Datasheet	Description
Motorola, Inc	MC33661	377Kb / 20P	LIN Enhanced Physical Interface
Texas Instruments	TPIC1021	208Kb / 13P	LIN Physical Interface
Freescale Semiconductor...	33399	435Kb / 19P	Local Interconnect Network (LIN) Physical Interface
Freescale Semiconductor...	MC33663	828Kb / 37P	LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer
Texas Instruments	SN65HVDA100-Q1	679Kb / 26P	LIN PHYSICAL INTERFACE
	SN65HVDA195-Q1	590Kb / 21P	LIN AND MOST ECL PHYSICAL INTERFACE
	TPIC1021A-Q1	290Kb / 20P	LIN PHYSICAL INTERFACE
	TPIC1021D	738Kb / 18P	LIN Physical Interface
Freescale Semiconductor...	MC33662LEF	577Kb / 31P	LIN 2.1 / SAEJ2602-2, LIN Physical Layer
NXP Semiconductors	TJA1027	650Kb / 24P	ISO 17987/LIN 2.x/SAE J2602 transceiver Rev. 3-18 December 2018